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  4. Analyse struktureller Eigenschaften von GaN mittels hochauflösender Röntgenbeugung bei variabler Meßtemperatur
 
Zitierlink URN
https://nbn-resolving.de/urn:nbn:de:gbv:46-diss000106704

Analyse struktureller Eigenschaften von GaN mittels hochauflösender Röntgenbeugung bei variabler Meßtemperatur

Veröffentlichungsdatum
2007-02-26
Autoren
Roder, Claudia  
Betreuer
Hommel, Detlef  
Gutachter
Heinke, Heidrun  
Zusammenfassung
The objective of this work is the investigation of the strain and the stress in GaN-based semiconductor layers by high-resolution x-ray diffraction (HRXRD) at variable temperatures. Due to the lack of native substrates GaN-based layers are typically grown on foreign substrates, which results in strained layers with a complex strain configuration. Moreover, heterostructures of group-III nitrides grown along the [0001] direction suffer from strong polarization fields perpendicular to their interfaces, which are undesirable for light-emitting devices whose active regions consist of quantum wells. Therefore, group-III nitride layers have been recently grown on non-polar planes, such as the a-plane. To account for the various questions regarding strain and stress in group-III-nitrides, the spectrum of different GaN layers, which were studied in this thesis, spans from bulk-like free-standing layers over thick c-plane layers to laterally overgrown structures and non-polar a-plane layers.
Schlagwörter
GaN

; 

x-ray diffraction

; 

strain

; 

stress

; 

HVPE

; 

a-plane

; 

non-polar

; 

Cantilever

; 

thermal expansion
Institution
Universität Bremen  
Fachbereich
Fachbereich 01: Physik/Elektrotechnik (FB 01)  
Dokumenttyp
Dissertation
Zweitveröffentlichung
Nein
Sprache
Deutsch
Dateien
Lade...
Vorschaubild
Name

00010670.pdf

Size

9.12 MB

Format

Adobe PDF

Checksum

(MD5):2133d7a106a6f3de458b191dc2cc4c24

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